die sizeの例文

• Reticle sizes ( die size limit ) are pretty much stagnant.
• Die size is 30 % smaller than the S08 core.
• It incorporates one floating point unit and one dedicated die size of.
• Without field stitching, die size would be limited.
• The macrocell array approach reduces the die size.
• This resulted in the die size decrease from 389 mm 2 to 243 mm 2.
• Ivy Bridge ) is a reduction in die size and a tock ( e . g.
• The transistor count was estimated to be 250 million and die size was estimated to be 420 mm 2.
• The meat, and the bones supplying the broth, is beef, frequently die sized bits and boiled soft.
• These factors have contributed to the rise of power as a major design parameter on par with performance and die size.
• The S-cache was removed to reduce the transistor count, which reduced the die size and in turn, cost.
• The chip has a die size of 19?9 mm ( 359.5 mm?) and uses 1.47 billion transistors.
• Aims of the simplified design include greater efficiency, greater cost-effectiveness for small-memory-size parts, and smaller die size.
• In memory design, storing two instead of one bit of information per memory cell doubles the density of the memory in the same die size.
• The 110 nm process was a cost-cutting process, designed not for high clock speeds but for reducing die size while maintaining high yields.
• It had a die size of 125 mm? a third smaller than the Alpha 21264A, and used a 1.7 V power supply.
• In 2004, the BLOOM II improved on the previous ASIC design by reducing its power consumption and die size, while maintaining 2 Gbit / s technology.
• The " Thoroughbred " core marked AMD's first production 130 nm silicon, resulting in a significant reduction in die size compared to its 180 nm predecessor.
• It has a die size of 232 mm 2 and was fabricated in a 0.13 祄, 7-layer copper metallization, CMOS process by Texas Instruments.
• This ramping of the speed would be difficult with interlocking involved, as the time needed to set up locks is as much a function of die size as clock rate.